Maria Nila Structure Repair Bond Builder 150ml

A lightweight leave-in treatment formulated with amino acids and chia peptides to repair, strengthen, and protect the hair bonds. The product contains heat protection (up to 230 degrees celsius), as well as both pro- and pre-bonding technologies, meaning it prepares and protects the hair, as well as it repairs existing damage. Apply to damp hair before heat styling or in dry hair as a final touch to smooth out the lengths. It has a fresh, green and floral scent, new to the Repair collection.

Directions

Apply to damp hair before heat styling or in dry hair as a final touch to smooth out the lengths.

Ingredients

Aqua/Water/Eau, Alcohol Denat., Propylene Glycol, Glycerin, Polysorbate 20, Dipropylene Glycol, Salvia Hispanica Seed Extract, Helianthus Annuus (Sunflower) Seed Extract, Leuconostoc/Radish Root Ferment Filtrate, Glycine, Isoleucine, Proline, Sodium PCA, Threonine, Histidine, PCA, Aspartic Acid, Arginine, Alanine, Phenylalanine, Serine, Valine, Polysilicone-29, Pentaerythrityl Tetra-Di-T-Butyl Hydroxyhydrocinnamate, Sodium Lactate, Propanediol, Butylene Glycol, Quaternium-95, Sodium Chloride, Benzoic Acid, Dehydroacetic Acid, Alpha-Isomethyl Ionone, Citrus Aurantium Peel Oil, Geraniol, Geranyl Acetate, Hydroxycitronellal, Linalool, Limonene, Pinene, Rose Ketones, Vanillin, Tetramethyl Acetyloctahydronaphthalenes, Terpineol, Phenoxyethanol, Parfum/Fragrance, CI 61570/Green 5, CI 47005/Yellow 10

This list of ingredients may be subject to change, please consult the packaging of the product purchased.